Technologies / GaN, SiC & Smart Power Electronics
GSP • PHASE 3 TECHNOLOGY

GaN, SiC & Smart Power Electronics

High-efficiency power conversion and motor/laser drive electronics for compact mobile agricultural systems.

Maturity Commercial semiconductor technology / Aurora application integration

Architecture role

Wide-bandgap semiconductors can reduce conversion losses and improve power density in selected motor drives, chargers, pumps, drones and high-speed switching functions. Conventional silicon remains appropriate where cost and performance already meet the need.

Core capabilities

  • High-efficiency motor inverters for mobile robots and selected drone propulsion.
  • Compact DC/DC conversion for distributed compute and sensor power domains.
  • Laser-driver and pulsed-power support where switching characteristics warrant it.
  • High-temperature-capable conversion for demanding field environments.
  • Health monitoring, current limiting and fault isolation integrated into the power architecture.

Aurora design direction

Aurora should use Si, SiC and GaN by engineering need rather than branding every product as wide-bandgap. Home systems may favor cost-effective silicon; high-power field and drone systems can justify SiC/GaN where efficiency and mass matter.